Features 特征
• 1 component resin 1组分树脂
• UV Curable 紫外线固化
• Easily peelable after curing 固化后易于剥离
• Soft texture after curing 固化后质地柔软
Applicable substrate 适用基材
PCB Substrate, Metal etc. PCB基板，金属等
Curing Condition 固化条件
UV Curing (365nm, 2000mJ/cm2 (In Nitrogen Atmosphere)) for 1~2 minuites
UV固化（365nm，2000mJ / cm2（在氮气氛中））1〜2分钟
